EP2SGX30CF780C5 vs EP2SGX30CF780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30CF780C5 sa pamamagitan ng Intel at EP2SGX30CF780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX30CF780C5 - Stratix II GX FPGA, 33.88K LE, 780-FBGA | Intel
EP2SGX30CF780C5 ⚠ Huling PagbiliIntel
EP2SGX30CF780I3 - 33,880-Cell Stratix II GX FPGA 780-BGA | Intel
EP2SGX30CF780I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX30CF780C5 | EP2SGX30CF780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33880 | — |
| Logic Array Blocks (LABs) | 1694 | 33,880 |
| Maximum User I/O Pins | 361 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm CMOS |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | -5 | — |
| Packhaging | 780-ball FBGA | 780-ball FC-FBGA (29 mm x 29 mm, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Transceivers | Multi-gigabit transceivers with embedded CDR | Embedded multi-gigabit transceivers (6.375 Gbps) |
| PLLs | 4 | — |
| Embedded Memory | M512 / M4K / M-RAM blocks (totals per datasheet) | — |
| DSP Blocks | Embedded multiplier/DSP blocks | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status not confirmed in supplied data] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Cells | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Number of User I/O Pins | — | 361 |
| Terminal Pitch | — | 1.0 mm |
| Temperature na Operasyon | — | -40 °C to +85 °C (Industrial) |
| Temperature Grade Suffix | — | I3 (Industrial) |
| Total Terminals | — | 780 |
| Package Code | — | BGA, square shape |