EP2SGX30DF780I5N vs EP2SGX30DF780I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX30DF780I5N sa pamamagitan ng Intel at EP2SGX30DF780I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX30DF780I5N EP2SGX30DF780I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND NRND
Family Stratix II GX Stratix II GX
Logic Cells 33,880 (33,380 logic elements) 33,380
Logic Array Blocks (LABs) 33,880 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Voltage 1.2 V —
Internal Clock Frequency (max) 622.08 MHz —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Number of Pins / Balls 780 —
Package Type FC-FBGA-780 (Flip-Chip Fine-pitch BGA) —
Package Size 29 x 29 mm, 1.0 mm pitch —
Temperature na Operasyon -40C to +85C (Industrial) —
Uri ng Pagpapasok Surface Mount Surface Mount
Lead-Free / RoHS Lead Free (per Kynix listing) —
Speed Grade I5 I3
Temperature Grade Suffix Industrial —
Logic Elements — 33,880
Configurable Logic Blocks (CLBs) — 33,880
Total Memory Bits — 1,369,728
Maximum Core Frequency — 622.08 MHz
Core Supply Voltage — 1.2 V
User I/O Pins — 361
Packhaging — 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch
Operating Temperature Grade — Industrial
Lead Free — Yes
Tindminan RoHS — Compliant

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