EP2SGX60CF780C3N vs EP2SGX60DF780C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60CF780C3N sa pamamagitan ng Intel at EP2SGX60DF780C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX60CF780C3N | EP2SGX60DF780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Tapus ng Buhay |
| Device Type | FPGA (Field Programmable Gate Array) | FPGA |
| Series | Stratix II GX | — |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| User I/O Pins | 364 | — |
| Embedded Memory (bits) | 2,544,192 | — |
| Number of CLBs | 60,440 | — |
| Internal Frequency (max) | 816.9 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Supply Voltage | 1.2 V | — |
| Transceiver Channels | 12 (up to 6.375 Gbps) | — |
| Package Type | 780-ball FC-FBGA | 780-pin FC-FBGA (DF780) |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm pitch | 23 x 23 mm |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Lead-free / Compliant | Compliant (per distributor listing) |
| Family | — | Stratix II GX |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| User I/Os | — | 364 |
| Pitch | — | 1 mm |
| Core Voltage | — | 1.2 V |
| Internal Frequency | — | 717 MHz |
| Propagation Delay | — | [DATA_NEEDED: propagation delay ns] |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range C] |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |