EP2SGX60EF1152I3N vs EP2SGX60FF1152 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX60EF1152I3N sa pamamagitan ng Intel at EP2SGX60FF1152 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2SGX60EF1152I3N | EP2SGX60FF1152 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix II GX | Stratix II GX FPGA |
| Device Type | Field-Programmable Gate Array (FPGA) | — |
| Logic Elements (LEs) | 60,440 | — |
| Configurable Logic Blocks (CLBs) | 60,440 | — |
| Embedded Memory Bits | 2,544,192 bits | — |
| Internal Frequency (max) | 717 MHz | — |
| Process Technology | 90 nm | 90 nm CMOS, SRAM-based |
| Core Voltage | 1.2 V | — |
| Package Type | 1152-ball FC-FBGA | — |
| Package Size | 35 x 35 mm (1 mm ball pitch) | — |
| Number of Terminals | 1152 | — |
| Terminal Form | Ball | — |
| Temperature Grade | Industrial (-40C to +100C junction) | — |
| Lead-Free | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | Stratix II GX |
| Logic Elements | — | 60,440 |
| Embedded Memory | — | 2,544,192 bits |
| DSP Blocks (18x18 Multipliers) | — | 192 (16 blocks) |
| Maximum User I/O | — | 364 |
| Number of LABs/CLBs | — | 3022 |
| Transceivers | — | 12 channels up to 3.125 Gbps |
| Packhaging | — | 1152-BBGA, FineLine BGA (FF1152) |
| Temperature na Operasyon | — | -40C to +85C (industrial) |
| Voltage - Supply | — | 1.2 V core / multiple VCCIO rails |
| Configuration Method | — | JTAG IEEE 1149.1, Serial, Passive Parallel, Fast Passive Parallel |