EP3C25F324C7N vs EP3C25F324I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C25F324C7N sa pamamagitan ng Intel at EP3C25F324I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C25F324C7N | EP3C25F324I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | Cyclone III | — |
| Logic Cells | 24,624 cells | — |
| Embedded Memory | 608,256 bits | 608,256 bits (594 Kbits M9K blocks) |
| Available I/O Pins | 215 I/O | — |
| Maximum Listed Frequency | 437.5 MHz | — |
| Process Technology | 65 nm | TSMC 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Packhaging | 324-ball FBGA | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Terminal Count | 324 terminals | — |
| Terminal Form | Ball | — |
| Package Code | BGA | — |
| Package Shape | Rectangular | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature Grading | Other | — |
| Programmability | Field programmable | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Series | — | Cyclone III |
| Logic Elements (LEs) | — | 24,624 |
| Logic Array Blocks (LABs) | — | 1,539 |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Temperature ng Junction na Operasyon | — | -40 °C to +100 °C (industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |