EP3C40F780C7N vs EP3C40F780C8 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3C40F780C7N sa pamamagitan ng Intel at EP3C40F780C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3C40F780C7N EP3C40F780C8
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone III Cyclone III
Logic Elements 39,600 LE 39,600
Total RAM Bits 1,161,216 bits —
Embedded Multipliers 126 (18x18) —
User I/Os 535 —
Packhaging 780-ball FBGA (FineLine BGA) 780-ball FBGA (FineLine BGA)
Speed Grade 7 (C7, commercial) C8 (commercial, -40C to +85C operating range per 'C' designator family convention)
Process Node 65 nm TSMC low-power —
Temperature na Operasyon 0C to +85C (commercial) —
Supply Voltage (Core) 1.2 V —
Configuration Method JTAG, Active Serial, Passive Serial —
PLLs 4 —
Global Clock Networks 20 20
Lead-Free / RoHS Yes (N suffix) —
Moisture Sensitivity Level MSL3 (per J-STD-020) —
Series — EP3C40
Total Memory Bits — 1,161,216 bits (1134 Kbit)
Embedded Memory — M9K blocks, 486 Kbit total (per family datasheet)
Embedded 18x18 Multipliers — 126
General Purpose PLLs — 4
Maximum User I/O Pins — 535
Process Technology — 65 nm low-power CMOS
User I/O Banks — [DATA_NEEDED: user I/O bank count]
Supported Memory Interfaces — DDR, DDR2, QDRII SRAM (via dedicated PHY)
Configuration — Serial (AS) / Parallel (AP) / JTAG
Tindminan RoHS — Compliant
Uri ng Pagpapasok — Surface Mount (BGA)

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