EP3C55F484C6 vs EP3C55F484C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484C6 sa pamamagitan ng Intel at EP3C55F484C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F484C6 | EP3C55F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III |
| Series | EP3C55 | — |
| Logic Elements | 55,856 LE | 55,856 |
| Embedded Memory | 2,396,160 bits (2.4 Mbit) | — |
| Maximum User I/O | 327 | 327 |
| Packhaging | 484-FBGA (F484) | 484-FBGA (FineLine BGA) |
| Process Technology | 65 nm low-power CMOS | 60 nm TSMC low-power |
| Core Voltage | 1.2 V | — |
| Speed Grade | 6 (commercial) | 7 |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Embedded 18x18 Multipliers | 56 | — |
| I/O Banks | 8 | — |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Configuration | JTAG, AS (EPCS), PS, FPP | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | Compliant |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to 85C (Commercial) |
| Embedded Memory (bits) | — | 2,396,160 |
| Number of LABs/CLBs | — | 3,491 |
| Embedded Multipliers (18x18) | — | 156 |
| PLLs | — | 4 |
| Configuration Modes | — | JTAG, AS, AP, PS |
| Encryption | — | AES-256 |
| Volte ng Pagbibigay | — | 1.2 V core (VCCINT) |