EP3C55F484I8N vs EP3C55F484C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F484I8N sa pamamagitan ng Intel at EP3C55F484C8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3C55F484C8N - Cyclone III FPGA, 55K LE, 484-FBGA | Intel / Altera
EP3C55F484C8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3C55F484I8N | EP3C55F484C8N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | — |
| Logic Elements (LE) | 55,856 | 55,856 |
| Logic Array Blocks (LAB) | 3,491 | — |
| Embedded Memory Bits | 2,396,160 bits (approximately 234 Kbytes) | 2,396,160 |
| Embedded Multipliers (18x18) | 312 | 260 |
| PLLs | 4 | 4 |
| User I/O Pins | 327 | 327 |
| I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | 1.2 V |
| Auxiliary Voltage (VCCAUX) | 2.5 V nominal | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V per bank | — |
| Packhaging | 484-ball FBGA (FineLine BGA), 23 mm x 23 mm | 484-BGA (FBGA), 23 x 23 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature ng Junction na Operasyon | -40 C to +100 C (industrial, suffix I8) | — |
| Speed Grade | 8 (slowest Cyclone III timing bin) | — |
| Process Technology | 65 nm low-power CMOS | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Level ng MSL | 3 | — |
| Device Family | — | Cyclone III |
| Memory Blocks (M9K) | — | 260 |
| Maximum Internal Frequency | — | 472 MHz |
| Package Height | — | 2.60 mm |
| Operating Temperature (Commercial) | — | 0 C to +85 C |
| Process Node | — | 65 nm TSMC low-power |
| Configuration | — | SRAM-based, JTAG / AS / PS modes |
| Lead-Free / RoHS | — | Yes - lead-free, RoHS compliant |