EP3C55F780C6N vs EP3C55F780C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C6N sa pamamagitan ng Intel at EP3C55F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F780C6N | EP3C55F780C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III FPGA | Cyclone III (low-cost FPGA) |
| Logic Elements (LE) | 55,856 | 55,856 |
| Embedded Memory (bits) | 2,396,160 | — |
| Embedded Memory (Kb) | 2,340 Kb | — |
| Embedded 18x18 Multipliers | 312 | 156 |
| Maximum User I/O | 377 | 377 |
| PLLs | 4 | 4 |
| Global Clocks | 20 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm TSMC low-power |
| Packhaging | 780-ball FBGA (F780) | 780-pin FBGA (29x29 mm, 1.0 mm pitch) |
| Package Code | BGA, 780 balls | — |
| Speed Grade | C6 | 8 (commercial, slowest) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial, 'C' suffix) |
| Tindminan RoHS | Compliant | Compliant (lead-free FBGA) |
| Uri ng Pagpapasok | Surface Mount | — |
| Voltage - Supply (Core) | 1.2 V (typical) | — |
| Voltage - I/O | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) | — |
| Logic Array Blocks (LAB) | — | 3,491 |
| Total RAM Bits | — | 2,396,160 bits (2396 Kbit) |
| Embedded Memory Blocks (M9K) | — | 260 |
| User I/O Banks | — | 4 |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Configuration Modes | — | Active Serial, Passive Serial, Fast Passive Parallel, JTAG |
| Internal Frequency (typ.) | — | 402 MHz |