EP3C55F780C8 vs EP3C55F780C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780C8 sa pamamagitan ng Intel at EP3C55F780C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C55F780C8 | EP3C55F780C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone III | Cyclone III FPGA |
| Logic Elements | 55,856 | — |
| Embedded Memory | 2,396,160 bits (234 M9K blocks) | — |
| Embedded Multipliers (18x18) | 156 | — |
| User I/O Pins | 377 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 65 nm | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Packhaging | 780-ball FBGA | 780-ball FBGA (F780) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 8 | C6 |
| Configuration Memory | SRAM-based | — |
| Tindminan RoHS | Compliant | Compliant |
| Series | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Embedded 18x18 Multipliers | — | 312 |
| Maximum User I/O | — | 377 |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |