EP3C55F780I8N vs EP3CLS200F780I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C55F780I8N sa pamamagitan ng Intel at EP3CLS200F780I8N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP3CLS200F780I8N - 198K LE Cyclone III LS FPGA, 780-FBGA | Altera
EP3CLS200F780I8N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3C55F780I8N | EP3CLS200F780I8N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Cyclone III | Cyclone III LS |
| Logic Elements (LEs) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,491 | 47 (per FPGAkey brief) |
| Embedded Memory (M9K blocks) | 234 Kbits total | — |
| Embedded 18x18 Multipliers | 156 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/Os | 377 | — |
| Core Supply Voltage | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | Low-power CMOS | 65 nm CMOS |
| Packhaging | 780-ball FBGA (FineLine BGA), 1.0 mm pitch | 780-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature (Industrial) | -40C to +100C | — |
| Configuration Method | JTAG / Active Serial / Passive Serial / Fast Passive Parallel | Passive/Active Serial, JTAG |
| Tindminan RoHS | Compliant | — |
| Logic Elements (LE) | — | 198,464 |
| Embedded Memory (Bits) | — | 8,211,456 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 402 MHz |
| Package Code | — | S-PBGA-B780 (JESD-30) |
| Package Body Size | — | 29.0 mm x 29.0 mm |
| Seated Height (Max) | — | 2.40 mm |
| Speed Grade | — | 8 |
| Temperature na Operasyon | — | -40 °C to +100 °C (Industrial) |
| RoHS / Lead-Free | — | Pb-free / RoHS compliant |