EP3C5U256C6N vs EP3C16U256C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C5U256C6N sa pamamagitan ng Intel at EP3C16U256C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3C5U256C6N - Cyclone III FPGA, 5,136 Logic Elements, 256-UBGA | Intel
EP3C5U256C6N ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP3C5U256C6N | EP3C16U256C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | — |
| Device Family | Cyclone III FPGA | — |
| Logic Elements | 5,136 | 15,408 |
| Logic Array Blocks (LABs) | 321 | — |
| Embedded Memory | 423,936 bits | — |
| Maximum User I/Os | 182 | — |
| Packhaging | 256-UBGA (Ultra FineLine BGA) | 256-ball Ultra FineLine BGA (Ux256, 17 mm x 17 mm) |
| Package Body Size | 14 x 14 mm | — |
| Ball Pitch | 0.80 mm | — |
| Package Height | 2.20 mm | — |
| Speed Grade | C6 | 8 (C8, commercial) |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Process Technology | 60 nm low-power CMOS | 65 nm low-power |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA, requires microvia PCB) |
| Lead Free / RoHS | Yes / Compliant | — |
| Configuration Modes | AS, PS, JTAG, Fast Passive Parallel | JTAG, AS, PS, FPP |
| Family | — | Cyclone III |
| Total Memory Bits | — | 516,096 bits |
| Embedded Multipliers (18 x 18) | — | 56 |
| PLLs | — | 4 |
| Maximum User I/O | — | 168 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Temperature ng Junction na Operasyon | — | -40 °C to +85 °C |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Tindminan RoHS | — | Compliant (Pb-free) |