EP3C80F484I7N vs EP3C80F484I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3C80F484I7N sa pamamagitan ng Intel at EP3C80F484I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3C80F484I7N | EP3C80F484I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements | 81,264 | 81,264 |
| Embedded Memory (RAM bits) | 2,810,880 | — |
| User I/O Count | 295 | — |
| Number of Logic Blocks / CLBs | 81,264 | — |
| Core Supply Voltage VCCINT | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| I/O Supply Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Maximum Internal Clock Frequency | 472.5 MHz | — |
| Number of PLLs | 4 | — |
| Number of 18x18 Multipliers | 244 | — |
| Process Technology | 60 nm low-power CMOS, SRAM-based | 65 nm low-power CMOS |
| Operating Temperature (Junction) | -40C to +100C (industrial I7 grade) | — |
| Packhaging | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Level ng MSL | 3 | 3 (per JEDEC J-STD-020) |
| Configuration Method | AS / PS / JTAG / FPP | — |
| Logic Array Blocks (LABs) | — | 5,079 |
| Total RAM Bits | — | 2,810,880 |
| M9K Memory Blocks | — | 244 |
| Embedded Multipliers (18x18) | — | 305 |
| Phase-Locked Loops (PLLs) | — | 4 |
| User I/Os | — | 295 |
| Core Voltage | — | 1.2 V |
| Internal Operating Frequency | — | Up to 472 MHz |
| Temperature na Operasyon | — | -40C to +100C (Industrial grade, "I7" suffix) |