EP3CLS100F780C8N vs EP3C80F780C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS100F780C8N sa pamamagitan ng Intel at EP3C80F780C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3CLS100F780C8N | EP3C80F780C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | — |
| Total Memory Bits | 4,451,328 | — |
| Embedded Memory Blocks | M9K + M144K | — |
| Logic Array Blocks (LAB) | 6,278 | — |
| Number of PLLs | 4 | — |
| Maximum User I/O | 429 | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Analog Supply (VCCA) | 2.5 V | — |
| Process Technology | 65 nm low-power CMOS | — |
| Maximum Embedded Multipliers (18x18) | 244 | — |
| Packhaging | 780-ball FBGA (FineLine BGA) | 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Configuration Schemes | AS, PS, PP, JTAG | — |
| Tindminan RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Family | — | Cyclone III |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 81,264 |
| Total RAM Bits | — | 2,810,880 bits |
| Embedded Multipliers | — | 244 (18x18) |
| User I/O | — | 429 |
| PLLs | — | 4 |
| Internal Frequency (max) | — | 472 MHz |
| Bilang ng Pins | — | 780 |
| Package Height | — | 2.60 mm |
| Lead Free / RoHS | — | Yes (lead-free) |
| Process Node | — | 60 nm TSMC low-k |
| Operating Temperature Grade | — | Commercial (C) |
| Speed Grade | — | 8 |