EP3CLS150F484C7 vs EP3CLS200F484C7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS150F484C7 sa pamamagitan ng Intel at EP3CLS200F484C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3CLS150F484C7 EP3CLS200F484C7
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone III LS Cyclone III LS
Logic Elements (LE) 149,760 198,464
Total Memory Bits 6,138,560 —
Embedded Multipliers (18x18) 396 —
User I/O Count 210 —
Configuration Logic Blocks (CLBs) 150,848 —
PLLs 4 4
Maximum User I/O Pins 210 —
Packhaging 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch
Process Technology 60 nm TSMC low-power CMOS CMOS, low-power
Supply Voltage Core (VCCINT) 1.2 V —
Supply Voltage Auxiliary (VCCAUX) 2.5 V —
Operating Temperature (Commercial) 0C to +85C —
Tindminan RoHS Compliant Compliant
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
AES Bitstream Encryption AES-256 with 64-bit volatile key —
Logic Array Blocks (LABs) — 12,408
Embedded Memory (RAM bits) — 8,211,456
Maximum User I/Os — 226
DSP Blocks — 396 (18x18 multipliers)
Core Supply Voltage (VCCINT) — 1.2 V
I/O Supply Voltage (VCCIO) — 1.2 V to 3.3 V
Temperature na Operasyon — 0C to +85C (commercial, C7 speed grade)
Configuration Method — JTAG, Passive Serial, Active Serial

Mga Datasheets at Resources

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