EP3CLS200F484C8 vs EP3CLS150F484C8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F484C8 sa pamamagitan ng Intel at EP3CLS150F484C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS150F484C8N - Cyclone III LS FPGA, 150K LE, 484-FBGA | Intel
EP3CLS150F484C8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS200F484C8 | EP3CLS150F484C8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone III LS | — |
| Family | Cyclone III LS (low-power Cyclone III) | Cyclone III LS |
| Logic Elements (LE) | 198,464 | 150,848 |
| Logic Array Blocks (LAB) | 20,5056 (approx) | — |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) | — |
| Embedded 18x18 Multipliers | 210 | — |
| PLLs | 4 | 4 |
| Maximum User I/O | 304 | — |
| I/O Banks | 8 | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power |
| Packhaging | 484-pin FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Security | Design encryption / bitstream AES | — |
| Temperature na Operasyon | 0C to +85C (commercial, 'C' suffix) | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Total RAM Bits | — | 6,137,856 bits |
| Embedded Multipliers (18x18) | — | 210 |
| Logic Array Blocks (LABs) | — | 9,428 |
| User I/O Pins | — | 226 (maximum) |
| Core Voltage (VCCINT) | — | 1.2 V |
| Speed Grade | — | 8 (commercial) |
| Maximum Operating Frequency | — | 402 MHz |
| Configuration Method | — | SRAM-based (external flash required) |
| Lead-Free | — | Yes |