EP3CLS200F484C8 - Cyclone III LS FPGA 198K LE | Intel | 484-BGA
MPN: EP3CLS200F484C8 ✓ NakahandaEP3CLS200F484C8 Ulas
What is a Cyclone III LS FPGA? The Cyclone III LS family is a low-power variant of Altera's Cyclone III series, optimized for power-sensitive applications such as industrial control, video processing, and portable instrumentation. FPGAs (Field-Programmable Gate Arrays) are programmable logic devices containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks (memory, multipliers, PLLs, transceivers). Unlike an ASIC, an FPGA is reprogrammable in the field, enabling rapid prototyping, hardware revision, and parallel-processing acceleration. In the system hierarchy, FPGAs sit between microcontrollers (fixed-function, sequential) and ASICs (fixed-function, high-volume).
Key features of the EP3CLS200F484C8 include up to 4 PLLs, 8 user I/O banks with support for multiple I/O standards (LVDS, SSTL, LVCMOS), and dedicated hardware for DDR/DDR2/QDRII memory interfaces. The device supports configuration via passive serial (PS), fast passive parallel (FPP), active serial (AS), and JTAG modes. Cyclone III LS adds enhanced security features including design encryption and configuration bitstream AES protection, making it suitable for designs where IP protection is required.
Technically, the EP3CLS200F484C8 leverages 65 nm process technology with a low-K dielectric, which reduces dynamic switching current by up to 50% compared to the original Cyclone II family. The architecture uses 4-input look-up tables (LUTs), embedded SRAM blocks (M9K - 9 Kbit and M144K - 144 Kbit), and DSP-style 18x18 multipliers that can be cascaded for higher-precision arithmetic. The 484-pin FBGA package provides high I/O count (up to 304 user I/O) in a 23x23 mm footprint with 1.0 mm ball pitch.
Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance subsystems, medical instrumentation, software-defined radio (SDR) baseband, and low-cost ASIC prototyping. The combination of high logic density, low power, and security features also makes it a strong fit for telecom line cards and portable test equipment.
When designing with the EP3CLS200F484C8, pay close attention to power-supply sequencing: the 1.2 V core must ramp before the I/O supplies. Use the Quartus II design toolchain (Cyclone III device support) for synthesis, place-and-route, and bitstream generation. Plan thermal dissipation at 304 user I/O + 198K logic elements - adequate airflow or a thermal pad is recommended at full utilization.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet, helping engineers rapidly evaluate whether the EP3CLS200F484C8 fits their design constraints and supply chain.
Mga alternatibo na pwedeng ilagay na EP3CLS200F484C8 — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok EP3CLS200F484C8 (parehas na form factor at footprint) — pagkakaiba sa Package, Process Technology, Operating Temperature, Speed Grade, Embedded Memory.
EP3CLS200F484C8N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3CLS200F484C7N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3CLS200F484C7
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3CLS200F484I7N
✅ Drop-In ⚠️ Mga Talaan Hindi NaiwerikmoMagkontak para sa presyo
Tingnan ang Datasheet →EP3CLS150F484C8N
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3CLS150F484C8
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →EP3CLS200F484C8 Mga Pinakamataas na Rating at Electrical Characteristics
| Series | Cyclone III LS |
| Family | Cyclone III LS (low-power Cyclone III) |
| Logic Elements (LE) | 198,464 |
| Logic Array Blocks (LAB) | 20,5056 (approx) |
| Embedded Memory | 8,211,456 bits (approx 8 Mbit) |
| Embedded 18x18 Multipliers | 210 |
| PLLs | 4 |
| Maximum User I/O | 304 |
| I/O Banks | 8 |
| Core Voltage | 1.2 V |
| Process Technology | 65 nm low-power CMOS |
| Packhaging | 484-pin FBGA (FineLine BGA) |
| Package Dimensions | 23 mm x 23 mm, 1.0 mm ball pitch |
| Configuration Modes | AS, PS, FPP, JTAG |
| Security | Design encryption / bitstream AES |
| Temperature na Operasyon | 0C to +85C (commercial, 'C' suffix) |
| Uri ng Pagpapasok | Surface Mount |
| Tindminan RoHS | Compliant |
Gabay sa Pin Configuration ng EP3CLS200F484C8 23 mm x 23 mm, 1.0 mm ball pitch
Pin configuration para sa EP3CLS200F484C8 (23 mm x 23 mm, 1.0 mm ball pitch package). Kasama sa digital IC na ito ang GPIO, mga communication interface (UART, SPI, I2C), at mga power pin. Sumangguni sa datasheet ng manufacturer para sa mga alternatibong function ng pin at mga opsyon sa configuration. Mahalaga para sa disenyo ng embedded system at PCB layout.
Wala ng detalyadong pinout data na magagamit para sa EP3CLS200F484C8.
Sumangguni sa datasheet para sa buong pin configuration.
Tipikal na mga Gamit
EP3CLS200F484C8 ay nararapat para sa 7 aplikasyons: Industrial Motor Control, Video Surveillance and Image Processing, Software-Defined Radio (SDR) Baseband, Medical Instrumentation, ASIC Prototyping, Telecom Line Cards and Low-Cost Networking, Automotive Infotainment and Driver-Assistance.
Industrial Motor Control
The EP3CLS200F484C8 fits industrial motor-control drives because its 198,464 LEs and 210 embedded 18x18 multipliers handle field-oriented control (FOC) loops, SVPWM generation, and encoder interface logic in a single device. The 8 Mbit embedded memory buffers current/voltage sample histories for FFT-based vibration analysis without external SRAM, reducing BOM. Cyclone III LS low-power operation keeps junction temperature manageable inside IP54-sealed inverter cabinets where convection cooling is limited. Quartus II DSP Builder accelerates development of CORDIC-based rotor-angle estimators. Engineers typically pair it with an external ADC such as the AD7606 for 16-bit simultaneous sampling across three motor phases.
Inirekomenda
Video Surveillance and Image Processing
In IP video surveillance and machine-vision pipelines the EP3CLS200F484C8's 198K LEs plus 210 DSP multipliers deliver 1080p60 H.264 encode pre-processing, edge enhancement, and motion-detection at the camera head. The 304 user I/O comfortably route two parallel image sensors plus DDR2 frame buffers. Low-power LS operation enables fanless PoE-powered camera designs. Designers commonly instantiate Altera's VIP (Video and Image Processing) suite for scaling, de-interlacing, and color-space conversion, then output BT.656 or MIPI-CSI to a host SoC. The bitstream AES feature protects proprietary analytic IP from reverse engineering.
Inirekomenda
Software-Defined Radio (SDR) Baseband
The EP3CLS200F484C8 supports low-to-mid-rate SDR baseband processing (HF, VHF, 2.4 GHz narrowband) where its 210 18x18 multipliers handle digital down-conversion, FIR filtering, and FFT-based demodulation. The 4 PLLs derive independent sample clocks for the ADC, DAC, and FPGA fabric, while the 8.2 Mbit embedded SRAM acts as a sample-history buffer. Cyclone III LS AES bitstream encryption is critical in SDR products where waveform IP must be protected from field tampering. The 484-BGA provides sufficient LVDS pairs for direct ADC interface without external serializer-deserializer parts.
Inirekomenda
Medical Instrumentation
In ultrasound front-end processing, patient-monitoring gateways, and portable diagnostics the EP3CLS200F484C8 provides the DSP density and low power envelope needed for multi-channel beamforming and real-time signal conditioning. The 210 multipliers run 64-tap FIR decimation filters on 32 receive channels simultaneously; 8 Mbit embedded memory stores beamformed line buffers. Commercial 0C-to-85C operation is sufficient for cart-based instruments, while the LS power reduction supports battery-powered handheld units. AES bitstream encryption helps meet FDA cybersecurity guidance for connected medical devices.
Inirekomenda
ASIC Prototyping
The EP3CLS200F484C8 is widely used as an ASIC prototyping vehicle because its 198K LEs and 8 Mbit embedded memory can map medium-complexity ASIC RTL (typically up to 5-8 million ASIC gates after synthesis efficiency). Multiple FPGAs can be chained via LVDS to validate larger designs. The Quartus II synthesis flow mirrors ASIC synthesis constraints, and the design-encryption feature prevents unauthorized bitstream cloning during customer evaluations. The commercial 85C temperature grade is adequate for in-lab functional verification.
Inirekomenda
Telecom Line Cards and Low-Cost Networking
The EP3CLS200F484C8 handles low-density packet processing, traffic shaping, and SERDES-based 1G Ethernet aggregation in telecom line cards and small-cell base stations. Its 304 user I/O comfortably route multiple SGMII/GMII interfaces, while 210 DSP blocks accelerate IPSec AES/SHA accelerators for small-cell security gateways. Cyclone III LS low-power operation is critical in sealed outdoor enclosures. Bitstream encryption protects operator credentials. The device interfaces naturally with external PHY chips such as the Marvell 88E1111 for 1000BASE-T copper connectivity.
Inirekomenda
Automotive Infotainment and Driver-Assistance
In rear-seat entertainment units, head-up displays, and low-tier ADAS the EP3CLS200F484C8 handles video overlay, multi-camera stitching, and sensor pre-processing. The 8.2 Mbit embedded memory buffers frame compositions, while 210 multipliers run perspective-warping kernels. While the commercial 85C grade covers in-cabin environments, designs targeting under-hood or engine-bay deployment should migrate to the EP3CLS200F484I7 (industrial) variant. Low-power LS operation reduces thermal load in sealed dashboard enclosures with limited airflow.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for EP3CLS200F484C8 — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | EP3CLS200F484C8N | EP3CLS200F484C7N | EP3CLS200F484C7 | EP3CLS200F484I7N | EP3CLS150F484C8N | EP3CLS150F484C8 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-pin FBGA | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same | 484-pin FBGA - same |
| Logic Elements | 198,464 | 198,464 | 198,464 | 198,464 | 198,464 | 153,912 (-22%) | 153,912 (-22%) |
| Embedded Memory | 8,211,456 bits | 8,211,456 bits | 8,211,456 bits | 8,211,456 bits | 8,211,456 bits | 6,635,520 bits (-19%) | 6,635,520 bits (-19%) |
| 18x18 Multipliers | 210 | 210 | 210 | 210 | 210 | 152 (-28%) | 152 (-28%) |
| Speed Grade | C8 (slowest) | C8 | C7 (faster) | C7 (faster) | I7 (industrial, faster) | C8 | C8 |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Commercial | Commercial | Industrial (-40C to 100C) | Commercial | Commercial |
| Lead-Free (Pb-free) | No (SnPb ball variant) | Yes | Yes | No | Yes | Yes | No |
| Bitstream AES Encryption | Yes (Cyclone III LS feature) | Yes | Yes | Yes | Yes | Yes | Yes |
Pangunahing mga Pagkakaiba
- Highest-density Cyclone III LS variant (kumpara saEP3CLS150F484C8N)
- Lowest cost in the 198K-LE density tier (kumpara saEP3CLS200F484C7N)
- AES-encrypted bitstream protection (kumpara saEP3CLS200F484I7N)
Talaan ng Disenyo
The EP3CLS200F484C8 requires multiple supply rails: 1.2 V core (VCCINT), 2.5 V analog PLL (VCCA_PLL), and per-bank I/O voltages (VCCIO) selectable per bank. Power-on sequencing is critical - VCCINT must ramp before VCCIO to prevent I/O buffer latch-up; use a sequencer IC such as the LTC2924 or TI TPS3808. Decoupling: place 0.1 uF X7R ceramics adjacent to every VCCINT pin, with bulk 220 uF polymer tantalum on the 1.2 V plane. Cyclone III LS power estimation should be run in Quartus II PowerPlay early in the design cycle; static power at 85C for full utilization can reach 1.5-2 W.
The 484-BGA at 1.0 mm pitch requires 4-layer PCB minimum with microvia stack-up. Per Intel Cyclone III hardware guidelines, all 484 balls must be soldered (no-connects still need paste for board-level reliability). Use 0.4 mm laser-drilled microvias in-pad for inner-layer breakout; outer-layer fanout can use 0.2 mm trace-and-space. Place configuration flash (EPCS) within 25 mm of the FPGA DATA/ASDO pins to minimize signal integrity issues. Maintain solid 1.2 V plane under the BGA for thermal dissipation - copper pours directly under BGA balls help sink 1-2 W at full utilization.
Common pitfalls: (1) Configuring via JTAG without also enabling AS-mode failsafe boot - the design appears dead in field if the EPCS flash is corrupted; (2) Mixing LVDS and LVCMOS in the same bank without proper VCCIO selection (LVDS requires 2.5 V VCCIO); (3) Forgetting to enable the on-chip 50-ohm series termination in the Quartus pin planner, causing SI failures at >200 MHz; (4) Using the wrong configuration mode (FPP vs AS) for the chosen flash memory width; (5) Setting unused pins to 'As input tri-stated' instead of 'As output driving ground' which can increase quiescent I/O leakage by 10x. Always validate with the Quartus II pin planner before tape-out.
Estimated: At full 198K-LE utilization, 80% toggle rate, 85C ambient, and 1.2 V VCCINT, the EP3CLS200F484C8 dissipates approximately 2.0-2.5 W (per Quartus PowerPlay early estimates). The 484-BGA theta_JA on a 4-layer JEDEC test board is approximately 18 C/W, implying a junction rise of 36-45 C above ambient - within the 85C commercial limit if ambient stays below 50 C. For sealed enclosures, attach a small aluminum heat spreader (20x20 mm, 1 mm thick) with thermal interface material to keep margin.
Impormasyon ng Pagsunod sa Kautusan
RoHS compliance: EP3CLS200F484C8 itself uses SnPb solder balls (non-Pb-free); the EP3CLS200F484C8N lead-free variant is required for RoHS-compliant end products. REACH: compliant per Intel material declaration. AEC-Q100: not qualified - this is a commercial-grade FPGA, not an automotive-qualified part. Conflict minerals: compliant under Section 1502 of the Dodd-Frank Act per Intel supplier declarations.