EP3CLS200F780I7N vs EP3SE110F780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS200F780I7N sa pamamagitan ng Intel at EP3SE110F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS200F780I7N - Cyclone III LS FPGA 198K LE | Intel | 780-FBGA
EP3CLS200F780I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP3CLS200F780I7N | EP3SE110F780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | — |
| Logic Elements | 198,464 | 107500 |
| Logic Array Blocks (LABs) | 12,404 LAB | — |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | — |
| Maximum User I/O | 413 | — |
| Process Technology | 65 nm CMOS (low-power) | 65 nm |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | — |
| Temperature na Operasyon | -40 °C to +100 °C (industrial) | -40C to +100C (industrial) |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Packhaging | 780-ball FBGA (FBGA-780) | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (lead-free per FBGA-780 datasheet note) | unknown |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Stratix III E |
| Number of LABs/CLBs | — | 4300 |
| Number of Logic Elements/Cells | — | 107500 |
| Total RAM Bits | — | 8936448 |
| Number of I/O | — | 488 |
| Voltage - Supply | — | 1.1 V core |
| Packhaging / Kaso | — | 780-BBGA, FCBGA (FineLine BGA) |
| Supplier Device Package | — | 780-FBGA |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | unknown |
| Grade | — | Industrial |