EP3CLS70F780I7N vs EP3CLS70F780C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F780I7N sa pamamagitan ng Intel at EP3CLS70F780C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP3CLS70F780I7N | EP3CLS70F780C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone III LS | — |
| Logic Elements | 70,208 | 70,208 |
| Embedded Memory | 3,068,928 bits | — |
| Maximum User I/O | 413 pins | 413 |
| Volte ng Pagbibigay | 1.2 V | 1.2 V |
| Temperature Grade | Industrial | — |
| Package Type | BGA | — |
| Package Pin Count | 780 balls | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Configuration Technology | SRAM-based FPGA | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature] | 0C to +85C (commercial) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | unknown | Compliant |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Family | — | Cyclone III LS |
| Logic Array Blocks | — | 47,452 |
| Total Memory Bits | — | 3,068,928 bits |
| Embedded Multipliers (18x18) | — | 200 |
| User I/O (this package) | — | 413 |
| Packhaging | — | 780-ball FBGA (F780) |
| Pins/Balls | — | 780 |
| Core Voltage | — | 1.2 V |
| Process Node | — | 60 nm |
| Transceivers | — | 0 (no high-speed transceivers) |