EP3CLS70F780I7N vs EP3SE50F780I4LG Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3CLS70F780I7N sa pamamagitan ng Intel at EP3SE50F780I4LG sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3CLS70F780I7N - 70,208 Logic Elements FPGA | Intel | Embedded Systems
EP3CLS70F780I7N ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP3CLS70F780I7N | EP3SE50F780I4LG |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone III LS | Stratix III E |
| Logic Elements | 70,208 | 47,500 |
| Embedded Memory | 3,068,928 bits | 5.49 Mbit |
| Maximum User I/O | 413 pins | — |
| Volte ng Pagbibigay | 1.2 V | — |
| Temperature Grade | Industrial | — |
| Package Type | BGA | — |
| Package Pin Count | 780 balls | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Configuration Technology | SRAM-based FPGA | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | unknown | — |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Family | — | Stratix III |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| Maximum User I/Os | — | 488 |
| Packhaging | — | 780-ball FCBGA (FBGA-780) |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Hanay ng Temperature na Operasyon | — | -40 C to +100 C |
| Process Node | — | 65 nm |
| DSP Blocks | — | Yes (dedicated, count not in source data) |
| High-Speed Transceivers | — | Multi-gigabit, count not in source data |
| Lead-Free / RoHS | — | Yes (G suffix = Pb-free) |
| Packaging | — | Tray |
| Uri ng Memory | — | Embedded SRAM block RAM |