EP3CLS70F780I7N vs EP3SE50F780I4LG 比較
詳細並排比較 EP3CLS70F780I7N 由 Intel 與 EP3SE50F780I4LG 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3CLS70F780I7N | EP3SE50F780I4LG |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | NRND |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Series | Cyclone III LS | Stratix III E |
| Logic Elements | 70,208 | 47,500 |
| Embedded Memory | 3,068,928 bits | 5.49 Mbit |
| Maximum User I/O | 413 pins | — |
| 供應電壓 | 1.2 V | — |
| Temperature Grade | Industrial | — |
| Package Type | BGA | — |
| Package Pin Count | 780 balls | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Configuration Technology | SRAM-based FPGA | — |
| Configuration Method | [DATA_NEEDED: configuration method] | — |
| 工作溫度 | [DATA_NEEDED: operating temperature] | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | unknown | — |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Family | — | Stratix III |
| Adaptive Logic Modules (ALMs) | — | 19,000 |
| Maximum User I/Os | — | 488 |
| 封裝 | — | 780-ball FCBGA (FBGA-780) |
| Operating Supply Voltage (Core) | — | 1.1 V |
| 工作溫度範圍 | — | -40 C to +100 C |
| Process Node | — | 65 nm |
| DSP Blocks | — | Yes (dedicated, count not in source data) |
| High-Speed Transceivers | — | Multi-gigabit, count not in source data |
| Lead-Free / RoHS | — | Yes (G suffix = Pb-free) |
| Packaging | — | Tray |
| 記憶體類型 | — | Embedded SRAM block RAM |