EP3SE110F1152I4 vs EP3SE110F1152C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F1152I4 sa pamamagitan ng Intel at EP3SE110F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F1152I4 EP3SE110F1152C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Family Stratix III E Stratix III Enhanced (E)
Logic Elements (LE) 107,500 —
Logic Array Blocks (LABs) 4300 4300
DSP Blocks 744 —
Embedded Memory (bits) 8,936,448 —
User I/Os 744 —
Packhaging 1152-ball FCBGA (Flip-Chip BGA) 1152-ball FCBGA (Flip-Chip BGA)
Temperature na Operasyon -40°C to +100°C (Industrial) 0C to +85C (Commercial)
Process Node 40 nm —
Maximum User I/O Speed [DATA_NEEDED: maximum I/O toggle rate MHz] —
PLLs 24 —
Configuration Modes JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) —
Memory Interface Support DDR3, DDR2, QDRII+, RLDRAM II —
Transceiver Protocol Support PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO —
Tindminan RoHS Compliant Compliant
Lead-Free Yes —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount
Level ng MSL [DATA_NEEDED: MSL rating] 3 (168 hours)
Logic Elements — 107,500
Memory Bits — 8,936,448
Embedded Multipliers (18x18) — 896
User I/O Pins — 744
Core Voltage — 1.1 V
Process Technology — 65 nm
Maximum Operating Frequency — 450 MHz
Configuration Method — Passive Serial / Fast Passive Parallel / JTAG / AES-256
Design Software — Quartus II (v9.1 or later)

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