EP3SE110F780C4LN vs EP3SE110F780C4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C4LN sa pamamagitan ng Intel at EP3SE110F780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE110F780C4LN EP3SE110F780C4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Stratix III E —
Logic Elements (LE) 107,500 —
Logic Array Blocks (LABs) 4,300 —
Embedded Memory 8,936,448 bits —
User I/O Pins 488 488
Packhaging 780-BBGA, FCBGA (Fine-pitch) —
Supply Voltage Core 0.9 V (typical) —
Temperature na Operasyon 0C to +85C (Commercial) 0C to +85C (commercial)
Speed Grade C4 -4 (commercial)
Lead-Free / RoHS Yes (N suffix) —
Uri ng Pagpapasok Surface Mount (SMT) Surface Mount
Process Technology 40 nm TSMC 65 nm CMOS
DSP Blocks Yes (18x18 multipliers) —
Level ng MSL 3 (per JEDEC J-STD-020) 3 (per JEDEC J-STD-020)
Tray Packaging Yes (per distributor listings) —
Series — Stratix III E
Number of Logic Elements (LE) — 107,500
Number of Logic Array Blocks (LAB) — [DATA_NEEDED: number of LABs]
Total Memory Bits — 8,936,448 bits
Number of 18x18 Multipliers — 488
Number of PLLs — [DATA_NEEDED: PLL count]
Process Variant — L (low-leakage)
Supply Voltage (Core) — [DATA_NEEDED: core voltage]
Package Type — 780-Ball FCBGA
Ball Pitch — 1.0 mm
Tindminan RoHS — Compliant

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