EP3SE110F780C4N vs EP3SE110F780I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE110F780C4N sa pamamagitan ng Intel at EP3SE110F780I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE110F780I3N - 107.5K Logic Elements, 780-FBGA FPGA | Intel Stratix III E
EP3SE110F780I3N NrndPagsanggunian na paghahambing
| Parametro | EP3SE110F780C4N | EP3SE110F780I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix III E | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LEs) | 107500 | — |
| Embedded Memory Bits | 8936448 | 8,936,448 (approximately 1.1 MB) |
| User I/O Count | 488 | — |
| Number of Terminals | 780 | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Speed Grade | C4 | 3 (Fast) |
| Temperature na Operasyon | 0C to 85C (Commercial) | -40 °C to +100 °C (Industrial, "I" grade) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Process Node | 65 nm | — |
| Configuration Mode | PS / FPP / JTAG | — |
| Logic Elements | — | 107,500 |
| Logic Array Blocks (LABs) | — | 4,300 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V (range 1.05 V to 1.15 V) |
| Process Technology | — | 65 nm CMOS |
| Packhaging | — | 780-pin FC-FBGA (Flip-Chip FineLine BGA) |
| Configuration Interface | — | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG (IEEE 1149.1) |
| Boundary-Scan Test | — | Yes, per IEEE Std. 1149.1 |
| PLLs | — | Yes, with global and regional clock networks |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Supply Voltage Tolerance | — | 1.05 V to 1.15 V |