EP3SE260F1152C2N vs EP3SE260F1152C2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C2N sa pamamagitan ng Intel at EP3SE260F1152C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1152C2N | EP3SE260F1152C2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | Stratix III E | Stratix® III E |
| Family | FPGA - Field Programmable Gate Array | — |
| Number of Logic Elements | 255000 | — |
| Number of LABs/CLBs | 10200 | — |
| Total Memory Bits | 16672768 | — |
| Number of I/O | 744 | — |
| Voltage - Supply | 1.1 V | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | [DATA_NEEDED: operating temperature grade] | Commercial (0 °C to +85 °C junction) [DATA_NEEDED: exact TJ limits] |
| Packhaging / Kaso | 1152-BBGA, FCBGA | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Maximum Frequency | 600 MHz | — |
| Supplier Device Package | 1152-FCBGA | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Tindminan RoHS | Compliant | Compliant |
| Lead Free | Yes (per EP3SE260F1152C2G comparison) | — |
| ECCN | [DATA_NEEDED: ECCN code] | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Manufacturer | — | Intel (formerly Altera) |
| Logic Elements (LE) | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/Os | — | 744 |
| User I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Core Voltage (VCCINT) | — | 1.1 V |
| Packhaging | — | 1152-ball FC-FBGA (Flip Chip) |
| Speed Grade | — | C2 (commercial) |
| Lead-Free | — | Yes |
| Design Software | — | Quartus II (Stratix III support) |