EP3SE260F1152C3 vs EP3SE110F1152C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3 sa pamamagitan ng Intel at EP3SE110F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1152C3 EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 - 255K LEs Stratix III E FPGA | Intel / Altera

EP3SE260F1152C3 ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C3 EP3SE110F1152C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Huling Pagbili
Series Stratix III E Stratix III
Logic Elements 255,000 —
Embedded Memory (bits) 16,672,768 —
Logic Array Blocks (LABs) 10,200 4,300
User I/Os 744 744
Embedded 18x18 Multipliers 384 —
Packhaging 1152-ball FCBGA (Flip-Chip BGA) —
Uri ng Pagpapasok Surface Mount Surface Mount
Core Voltage 0.9 V to 1.1 V —
Process Technology 40 nm 65 nm TSMC
Temperature na Operasyon 0C to +85C (Commercial) 0 °C to 85 °C (commercial)
Configuration Method Passive Serial / Fast Passive Parallel / JTAG —
PLLs 12 —
Tindminan RoHS Compliant —
Speed Grade C3 C3
Family — Stratix III E
Logic Elements (LE) — 107,500
Total RAM Bits — 8,936,448
Operating Frequency (max) — 500 MHz
Core Supply Voltage — 1.1 V nominal
I/O Supply Voltage — [DATA_NEEDED: I/O supply range]
Package Type — FC-FBGA-1152 (flip-chip BGA)
Style ng Pagpapasok — SMD/SMT (Tray)
DSP Blocks — Yes (embedded multipliers)
Uri ng Memory — M9K and M144K block RAM
External Memory Support — DDR/DDR2/DDR3 with read/write leveling
Boundary Scan — IEEE 1149.1 (JTAG)
RoHS — [DATA_NEEDED: RoHS status]
Lead-Free — Yes (per Altera/Intel datasheet family convention)

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