EP3SE260F1152C3N vs EP3SE260F1152C2G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C3N sa pamamagitan ng Intel at EP3SE260F1152C2G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152C3N EP3SE260F1152C2G
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Obsolete
Series Stratix III E EP3SE260
Logic Elements / Cells 255,000 255000
Embedded Memory Bits 16,672,768 bits —
Logic Array Blocks (LABs) 10,200 —
User I/O Count 744 —
Packhaging 1152-BBGA, FCBGA 1152-BBGA, FCBGA (FineLine BGA)
Uri ng Pagpapasok Surface Mount Surface Mount
Process Technology 65 nm —
Core Voltage 1.1 V 1.1 V
Temperature na Operasyon 0 C to +85 C (Commercial) —
Transceivers Integrated high-speed transceivers —
DSP Blocks Yes (dedicated multiplier/accumulator) —
Embedded Memory Type TriMatrix (true dual-port, FIFO, ROM, RAM) —
External Memory Support DDR3, DDR2, QDR II+, RLDRAM II —
Configuration Modes AS, AP, PS, FPP, JTAG —
Partial Reconfiguration Supported —
Programmable Power Technology Yes (up to 50% dynamic power reduction) —
Tindminan RoHS Compliant Compliant (G suffix)
Family — Stratix III E
Total RAM Bits — 16672768
Number of LABs / CLBs — 10200
Number of I/O — 744
Number of Terminals — 1152
Package Code — BGA (Ball Grid Array)
Package Shape — Square
Technology / Process Node — 65 nm
Speed Grade — C2 (commercial)
Lead-Free (RoHS) — Yes (G suffix)
Operating Temperature Grade — Commercial (C)
Supply Packaging — Tray

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita