EP3SE260F1152C4N vs EP3SE260F1152I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152C4N sa pamamagitan ng Intel at EP3SE260F1152I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1152C4N | EP3SE260F1152I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III (Enhanced) | Stratix III |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | — |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | 40 nm TSMC low-power |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 450 MHz | — |
| Packhaging | 1152-ball FC-FBGA (flip-chip) | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed Grade | -4 (commercial temperature) | I3 (Industrial, balanced) |
| Temperature na Operasyon | 0C to +85C (commercial, 'C' suffix) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| Uri ng Memory | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | — |
| Logic Elements (LE) | — | 255,000 |
| Embedded Memory Bits | — | 16,672,640 bits |
| Embedded Memory Bits (alternate) | — | 20,880 Kb (16,672,640 / 1024) |
| User I/O Count | — | 744 |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Supply Voltage Core | — | 0.9 V (typical, see handbook) |
| Configuration Bitstream Encryption | — | AES-256 (Stratix III feature) |
| I/O Standards Supported | — | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance not stated in scraped data] |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] |
| Lead-Free Reflow | — | [DATA_NEEDED: peak reflow temperature] |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Country of Origin / Distribution | — | Multiple authorized distributors (DigiKey, Mouser) |