EP3SE260F1152C4N vs EP3SE260F1152I3G 比較

詳細並排比較 EP3SE260F1152C4N 由 Intel 與 EP3SE260F1152I3G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260F1152C4N EP3SE260F1152I3G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 Obsolete NRND
Series Stratix III E Stratix III E
Family Stratix III (Enhanced) Stratix III
Logic Elements (LEs) 255,000 —
Embedded Memory 16,672,768 bits (16.67 Mbit) —
Maximum User I/Os 744 —
Number of LABs/CLBs 10,200 —
DSP / 18x18 Multipliers 768 embedded multipliers —
Process Technology 65 nm CMOS 40 nm TSMC low-power
Core Voltage 1.1 V —
Maximum Operating Frequency 450 MHz —
封裝 1152-ball FC-FBGA (flip-chip) 1152-BBGA, FCBGA (FineLine BGA)
Speed Grade -4 (commercial temperature) I3 (Industrial, balanced)
工作溫度 0C to +85C (commercial, 'C' suffix) —
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
Packaging Tray —
Lead-Free / RoHS Lead-free finish (RoHS compliant per distributor listing) —
記憶體類型 SRAM-based, volatile (requires configuration device) —
Configuration External EPCS / enhanced configuration via AS, PS, JTAG, or FPP —
Product Status Obsolete (per Xecor cross-reference data) —
Logic Elements (LE) — 255,000
Embedded Memory Bits — 16,672,640 bits
Embedded Memory Bits (alternate) — 20,880 Kb (16,672,640 / 1024)
User I/O Count — 744
工作溫度範圍 — -40C to +100C (Industrial)
Supply Voltage Core — 0.9 V (typical, see handbook)
Configuration Bitstream Encryption — AES-256 (Stratix III feature)
I/O Standards Supported — LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X
RoHS 狀態 — [DATA_NEEDED: RoHS compliance not stated in scraped data]
濕度敏感等級 (MSL) — [DATA_NEEDED: MSL rating per JEDEC J-STD-020]
Lead-Free Reflow — [DATA_NEEDED: peak reflow temperature]
Design Toolchain — Quartus II / Quartus Prime
Country of Origin / Distribution — Multiple authorized distributors (DigiKey, Mouser)

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