EP3SE260F1152I3 vs EP3SE260F1152I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I3 sa pamamagitan ng Intel at EP3SE260F1152I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260F1152I3 | EP3SE260F1152I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | Stratix III E (EP3SE260) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Number of LABs/CLBs | 10,200 | — |
| Total RAM Bits | 16,672,768 | — |
| User I/O Count | 744 | — |
| Number of Embedded Multipliers (DSP blocks) | 768 | — |
| Core Voltage | 1.1 V | 0.86 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Process Technology | 65 nm | TSMC 40 nm |
| Maximum Fabric Frequency | 500 MHz | — |
| Packhaging | 1152-BBGA, FC-FBGA (Flip-Chip) | 1152-ball FCBGA (35 mm x 35 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | I3 (Industrial, speed bin 3) | 4 |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 (168 hours) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Product Status | Obsolete (per Xecor comparator) | — |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/O | — | 744 |
| DSP Blocks (18x18 multipliers) | — | 896 |
| Transceivers | — | 48 (up to 8.5 Gbps) |