EP3SE260F1517C3 vs EP3SE260F1517C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C3 sa pamamagitan ng Intel at EP3SE260F1517C4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C3 | EP3SE260F1517C4 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | — |
| Process Node | 65 nm (TSMC) | 40 nm |
| Packhaging | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | -4 |
| Configuration | SRAM-based, requires external configuration device | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant (per Altera product page) |
| Family | — | Stratix® III E FPGA |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 10,200 LABs / 10200 ALMs (per Mouser listing) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/O Count | — | 976 |
| DSP Blocks | — | 768 (18x18 multipliers per Mouser listing) |
| Ball Count | — | 1517 |
| Package Style | — | Flip-Chip BGA |
| Temperature na Operasyon | — | Commercial (0C to +85C) - inferred from C4 suffix |
| Lead-Free | — | Yes |