EP3SE260F1517C3 vs EP3SE260F1517I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C3 sa pamamagitan ng Intel at EP3SE260F1517I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C3 | EP3SE260F1517I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | — |
| Logic Elements | 255,000 | 255,000 |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm (TSMC) | 65 nm |
| Packhaging | 1517-BBGA, FCBGA (FineLine BGA) | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | Industrial (-40C to +100C) |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Tindminan RoHS | Compliant | — |
| Family | — | Stratix III E |
| Embedded Memory Bits | — | 16,672,768 |
| Maximum Operating Frequency | — | 500 MHz |
| User I/O Count | — | 976 |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |