EP3SE260F1517C3 vs EP3SL340F1517C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C3 sa pamamagitan ng Intel at EP3SL340F1517C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C3 | EP3SL340F1517C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix III E | Stratix III L |
| Logic Elements | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 multipliers) | 768 | — |
| PLLs | 12 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Node | 65 nm (TSMC) | — |
| Packhaging | 1517-BBGA, FCBGA (FineLine BGA) | 1517-BBGA, FCBGA |
| Package Pitch | 1.0 mm | — |
| Operating Temperature Grade | Commercial (C suffix) | — |
| Speed Grade | 3 | — |
| Configuration | SRAM-based, requires external configuration device | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 337,500 |
| Logic Elements/Cells | — | 337,500 |
| LABs | — | 13,500 |
| User I/O | — | 976 |
| Memory Bits | — | 18,822,144 bits |
| Process Technology | — | 65 nm |
| Maximum Reported Frequency | — | 500 MHz |
| Terminal Count | — | 1517 pins |
| Package Shape | — | Square |
| Terminal Form | — | Ball |
| Temperature na Operasyon | — | [DATA_NEEDED: operating temperature range] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |