EP3SE260F1517C3N vs EP3SE260F1517C2G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C3N sa pamamagitan ng Intel at EP3SE260F1517C2G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517C3N | EP3SE260F1517C2G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 254,400 | 254,400 |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | 20 |
| Packhaging | 1517-BBGA (FCBGA) | 1517-ball FCBGA, 40x40 mm |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Speed Grade | C3 (commercial) | C2 (commercial, ~6 ns) |
| Temperature ng Junction na Operasyon | 0 C to +85 C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Tindminan RoHS | Compliant | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Adaptive Logic Modules (ALMs) | — | 81,760 |
| Total Memory Bits | — | 16,727,680 (16.67 Mbit) |
| Embedded Memory (M9K Blocks) | — | 864 |
| Embedded Multipliers (18x18) | — | 768 |
| User I/O Pins | — | 976 |
| Transceiver Channels | — | 12 |
| Transceiver Data Rate (max) | — | 3.75 Gbps (C2 grade) |
| PLLs (Fractional + Clock Multiplier) | — | 8 fractional + 4 CMU |
| Temperature na Operasyon | — | 0C to 85C (commercial, "C" suffix) |
| Process Node | — | 40 nm TSMC |
| Lead-Free / Halogen-Free | — | Yes / Yes |