EP3SE260F1517C3N vs EP3SE260F1517C2G 比較

詳細並排比較 EP3SE260F1517C3N 由 Intel 與 EP3SE260F1517C2G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SE260F1517C3N EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N - 260K LE Stratix III E FPGA | Intel

EP3SE260F1517C3N ⚠ 最後購買機會

規格比較

參數 EP3SE260F1517C3N EP3SE260F1517C2G
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family Stratix III E Stratix III E
Logic Elements 254,400 254,400
Embedded Memory 16,672,768 bits (16.7 Mbits) —
User I/Os 976 —
DSP Blocks (18x18 Multipliers) 816 —
M9K Memory Blocks 1,040 —
Maximum Transceiver Data Rate 600 Mbps —
PLLs 4 —
Global Clock Networks 16 20
封裝 1517-BBGA (FCBGA) 1517-ball FCBGA, 40x40 mm
Process Technology 65 nm TSMC low-power CMOS —
Speed Grade C3 (commercial) C2 (commercial, ~6 ns)
工作接面溫度 0 C to +85 C (commercial) —
安裝類型 Surface Mount —
RoHS 狀態 Compliant Compliant
External Memory Interfaces DDR3, DDR2, QDRII+, RLDRAM2 —
Adaptive Logic Modules (ALMs) — 81,760
Total Memory Bits — 16,727,680 (16.67 Mbit)
Embedded Memory (M9K Blocks) — 864
Embedded Multipliers (18x18) — 768
User I/O Pins — 976
Transceiver Channels — 12
Transceiver Data Rate (max) — 3.75 Gbps (C2 grade)
PLLs (Fractional + Clock Multiplier) — 8 fractional + 4 CMU
工作溫度 — 0C to 85C (commercial, "C" suffix)
Process Node — 40 nm TSMC
Lead-Free / Halogen-Free — Yes / Yes

資料表與資源

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