EP3SE260F1517C4LN vs EP3SE260F1517C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517C4LN sa pamamagitan ng Intel at EP3SE260F1517C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SE260F1517C4LN EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel

EP3SE260F1517C4LN ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SE260F1517C4LN EP3SE260F1517C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Series Stratix III E Stratix® III E
Family Stratix III E (Enhanced) Field-Programmable Gate Array (FPGA)
Logic Elements 255,000 255,000
Number of LABs/CLBs 10,200 —
Total Memory Bits 16,672,768 (16.67 Mbit) —
Number of I/O 976 —
Number of Gates [DATA_NEEDED: gate count not published in web data] —
Voltage - Supply 0.9 V to 1.1 V core —
Operating Frequency 375 MHz to 450 MHz (per family) —
Process Technology 65 nm —
Packhaging / Kaso 1517-BBGA, FCBGA (FC-FBGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) Surface Mount
Temperature na Operasyon 0C to +85C (commercial grade per 'C' suffix) 0°C to 85°C
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 Hours) —
Packaging Tray —
Speed Grade C4 —
Lead-Free / Halogen-Free Yes (LN suffix) —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS status]
Embedded Memory — 16,672,768 bits
Logic Array Blocks (LABs) — 10,200
Maximum User I/Os — 976
Packhaging — 1517-BBGA, FCBGA
Core Voltage — 0.9 V
Process Node — 65 nm
Level ng MSL — [DATA_NEEDED: MSL level]
Lead Free — [DATA_NEEDED: lead-free status]
Maximum Transceiver Data Rate — 12.5 Gbps

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