EP3SE260F1517I3 vs EP3SE260F1517I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1517I3 sa pamamagitan ng Intel at EP3SE260F1517I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260F1517I3 | EP3SE260F1517I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Embedded Memory (bits) | 16,672,768 | — |
| Logic Array Blocks (LABs) | 10,200 | — |
| Maximum User I/Os | 976 | — |
| Packhaging | 1517-BBGA, FCBGA | 1517-ball FC-FBGA (Flip-Chip BGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | Industrial (-40C to +100C) |
| Junction Temperature Range | -40C to +125C | — |
| Core Voltage | 1.0 V typical | 1.1 V |
| Process Technology | 65 nm CMOS | — |
| Maximum Core Frequency | 717 MHz | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL | — |
| Tindminan RoHS | Compliant | — |
| Configuration | SRAM-based, volatile (requires external configuration device) | — |
| Embedded Memory Bits | — | 16,672,768 |
| Maximum Operating Frequency | — | 500 MHz |
| User I/O Count | — | 976 |
| Process Node | — | 65 nm |
| Embedded Multipliers | — | 768 (18x18) |
| PLL Count | — | 12 |
| Transceiver Data Rate | — | Up to 6.375 Gbps |
| Lead-Free / RoHS | — | Yes (RoHS compliant per DigiKey listing) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |