EP3SE260H780I3 vs EP3SL200H780I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I3 sa pamamagitan ng Intel at EP3SL200H780I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SE260H780I3 | EP3SL200H780I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III E | Stratix III L |
| Logic Elements | 255,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 | — |
| Embedded 18x18 Multipliers | 384 | — |
| User I/Os | 488 | — |
| Operating Frequency (logic) | 500 MHz | — |
| Operating Frequency (internal max) | 800 MHz | — |
| Process Technology | 65 nm | — |
| Core Voltage | 1.1 V | — |
| Packhaging | 780-Ball FC-HFBGA / FCBGA | 780-BBGA, FCBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 (168 Hours) | — |
| Tindminan RoHS | Lead Free / Compliant | Compliant |
| Temperature na Operasyon | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| RAM Bits | — | 10,901,504 |
| User I/O | — | 488 |
| Package Pin Count | — | 780 |
| Supply Voltage (Core) | — | 0.9 V |
| Technology | — | CMOS, 40 nm |
| Process Node | — | 40 nm |
| Number of Terminals | — | 780 |
| Case / Package Code | — | BGA-780 |
| Lead-Free | — | Yes |