EP3SE260H780I4 vs EP3SE260H780C4LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4 sa pamamagitan ng Intel at EP3SE260H780C4LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE260H780C4LN - Stratix III E FPGA 255K LE 780-FCBGA | Intel
EP3SE260H780C4LN ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE260H780I4 | EP3SE260H780C4LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| Packhaging | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (FineLine BGA) |
| Temperature na Operasyon | -40C to +100C (industrial, 'I' grade) | 0C to +85C (commercial) |
| Speed Grade | 4 | C4 (commercial, moderate speed) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Count | — | 488 |
| Core Voltage (VCC) | — | 1.0 V |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Auxiliary Voltage (VCCPD/VCCPT) | — | 2.5 V / 3.0 V |
| PLLs | — | 8 |
| Global Clock Networks | — | 16 |
| Process Node | — | 40 nm TSMC |
| Configuration Modes | — | FPP, AS, PS, JTAG |
| Level ng MSL | — | 3 (168 hours) |