EP3SE260H780I4 vs EP3SE260H780C4LN 比較
詳細並排比較 EP3SE260H780I4 由 Intel 與 EP3SE260H780C4LN 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780I4 | EP3SE260H780C4LN |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | 最後購買 |
| Family | Stratix III Enhanced (Stratix III E) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Logic Cells | 255,000 | — |
| Logic Array Blocks (LABs) | 10,200 | 10,200 |
| Adaptive Logic Modules (ALMs) | approximately 203,200 | — |
| Maximum User I/Os | 488 | — |
| Process Technology | 65 nm CMOS | — |
| Core Voltage | 1.1 V | — |
| Embedded RAM (total) | approximately 14.4 Mbit (M9K/M144K blocks) | — |
| DSP Blocks | approximately 768 (18x18 multipliers) | — |
| Maximum Operating Frequency | up to 450 MHz core / 717 MHz per Partstack record | — |
| 封裝 | 780-ball FC-HFBGA (HBGA) | 780-ball FCBGA (FineLine BGA) |
| 工作溫度 | -40C to +100C (industrial, 'I' grade) | 0C to +85C (commercial) |
| Speed Grade | 4 | C4 (commercial, moderate speed) |
| 安裝類型 | Surface Mount (BGA) | — |
| Configuration Schemes | JTAG, Passive Serial, Fast Passive Parallel, Active Serial | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Embedded Multipliers (18x18) | — | 384 |
| User I/O Count | — | 488 |
| Core Voltage (VCC) | — | 1.0 V |
| I/O Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Auxiliary Voltage (VCCPD/VCCPT) | — | 2.5 V / 3.0 V |
| PLLs | — | 8 |
| Global Clock Networks | — | 16 |
| Process Node | — | 40 nm TSMC |
| Configuration Modes | — | FPP, AS, PS, JTAG |
| MSL 等級 | — | 3 (168 hours) |