EP3SE260H780I4 vs EP3SE260H780I4L Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4 sa pamamagitan ng Intel at EP3SE260H780I4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780I4 EP3SE260H780I4L
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III Enhanced (Stratix III E) Stratix III E (Enhanced)
Logic Elements 255,000 255,000
Logic Cells 255,000 —
Logic Array Blocks (LABs) 10,200 —
Adaptive Logic Modules (ALMs) approximately 203,200 —
Maximum User I/Os 488 —
Process Technology 65 nm CMOS 65 nm
Core Voltage 1.1 V 0.9 V
Embedded RAM (total) approximately 14.4 Mbit (M9K/M144K blocks) —
DSP Blocks approximately 768 (18x18 multipliers) —
Maximum Operating Frequency up to 450 MHz core / 717 MHz per Partstack record —
Packhaging 780-ball FC-HFBGA (HBGA) —
Temperature na Operasyon -40C to +100C (industrial, 'I' grade) Industrial, -40C to +85C
Speed Grade 4 —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (flip-chip)
Configuration Schemes JTAG, Passive Serial, Fast Passive Parallel, Active Serial —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] Compliant (lead-free)
Total Memory Bits — 16,672,640
Number of LABs/CLBs — [DATA_NEEDED: LAB count]
User I/O Count — 488
Package Type — 780-pin FC-HFBGA (flip-chip BGA)
Number of Transceivers — 24 (family-level maximum, per-pin count depends on variant)
Max Transceiver Data Rate — 6.375 Gbps (Stratix III E family spec)
Number of 18x18 Multipliers — [DATA_NEEDED: per-package multiplier count]
Configuration Mode — JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel
Pin/Package — 780-BBGA, FCBGA (flip-chip)

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