EP3SE260H780I4L vs EP3SE260H780I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780I4L sa pamamagitan ng Intel at EP3SE260H780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780I4L EP3SE260H780I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III E (Enhanced) Stratix III E
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 16,672,768
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 —
Core Voltage 0.9 V 1.1 V
Process Technology 65 nm 65 nm
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Uri ng Pagpapasok Surface Mount (flip-chip) Surface Mount
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Temperature na Operasyon Industrial, -40C to +85C -40C to +100C (Industrial)
Tindminan RoHS Compliant (lead-free) Lead Free / Compliant
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
LABs/CLBs — 10,200
Embedded 18x18 Multipliers — 384
User I/Os — 488
Operating Frequency (logic) — 500 MHz
Operating Frequency (internal max) — 800 MHz
Packhaging — 780-Ball FC-HFBGA / FCBGA
Level ng Sensitivity sa Asid ng Moisture (MSL) — 3 (168 Hours)

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