EP3SE260H780I4L vs EP3SE260H780I3 比較
詳細並排比較 EP3SE260H780I4L 由 Intel 與 EP3SE260H780I3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE260H780I4L | EP3SE260H780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | NRND |
| Family | Stratix III E (Enhanced) | Stratix III E |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 | 16,672,768 |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Technology | 65 nm | 65 nm |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| 安裝類型 | Surface Mount (flip-chip) | Surface Mount |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| 工作溫度 | Industrial, -40C to +85C | -40C to +100C (Industrial) |
| RoHS 狀態 | Compliant (lead-free) | Lead Free / Compliant |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| LABs/CLBs | — | 10,200 |
| Embedded 18x18 Multipliers | — | 384 |
| User I/Os | — | 488 |
| Operating Frequency (logic) | — | 500 MHz |
| Operating Frequency (internal max) | — | 800 MHz |
| 封裝 | — | 780-Ball FC-HFBGA / FCBGA |
| 濕度敏感等級 (MSL) | — | 3 (168 Hours) |