EP3SE50F780C3 vs EP3SL50F780C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780C3 sa pamamagitan ng Intel at EP3SL50F780C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F780C3 EP3SL50F780C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Family Stratix III E Stratix III L
Logic Elements (LE) 47,500 47,500
Embedded Memory (BRAM) 5,760 Kbits —
User I/Os 488 —
Packhaging 780-ball FC-FBGA (FineLine BGA) 780-ball FBGA
Process Technology 65 nm TSMC 40 nm low-power
Core Voltage 1.1 V 1.1 V
Logic Voltage 0.9 V —
Transceiver Speed (max) 500 MHz —
Total LABs/CLBs 1900 —
DSP Blocks [DATA_NEEDED: DSP block count] —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Uri ng Pagpapasok Surface Mount (BGA) SMD/SMT
Temperature na Operasyon 0C to +85C (Commercial grade, 'C' suffix) 0C to +85C (commercial)
Tindminan RoHS [DATA_NEEDED: RoHS status] Compliant (per DigiKey listing)
Level ng MSL [DATA_NEEDED: MSL level] —
Adaptive Logic Modules (ALM) — 19,000
Embedded Memory (bits) — 2,184,192
Distributed RAM — 2.08 Mbit
User I/O Count — 488
Temperature Grade Suffix — C (commercial, "3" speed grade)
Packaging — Tray
Configuration Method — SRAM-based, JTAG/AS configuration
Design Software — Intel Quartus II (v9.0+)

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