EP3SE50F780I3 vs EP3SL50F780I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE50F780I3 sa pamamagitan ng Intel at EP3SL50F780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE50F780I3 EP3SL50F780I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III Enhanced (E) —
Logic Elements 47,500 47,500
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory (bits) 5,760,000 —
User I/O Count 488 —
Internal Frequency (max) 800 MHz —
Hanay ng Temperature na Operasyon -40 C to +100 C (industrial, 'I' grade) —
Supply Voltage (Core) 0.86 V to 1.13 V (typical 1.1 V) —
Process Technology 65 nm 65 nm
Packhaging 780-ball FC-FBGA (FineLine BGA) 780-ball FC-FBGA (FineLine BGA), 1 mm pitch
Configuration Mode Passive Serial / Fast Passive Parallel / JTAG —
PLLs Up to 8 (fractional-N) —
DSP Multiplier Blocks Yes (per-ALM DSP blocks) —
Adaptive Logic Modules (ALMs) Yes —
Tindminan RoHS Compliant Compliant
Level ng MSL 3 (168 hours) —
Lead-Free Yes —
Series — Stratix III L
User I/O Pins — 488
Total Memory Bits — 2,106 Kbit (M9K + M144K)
Transceiver Channels — 16 (up to 3.75 Gbps) + 8 (up to 6.5 Gbps)
Core Voltage — Selectable 1.1 V / 0.9 V
Speed Grade — I3 (industrial, third-fastest bin)
Temperature na Operasyon — -40C to +100C (industrial)
Uri ng Pagpapasok — Surface Mount
Lead Free — Yes
Vertical Migration — Drop-in to EP3SL70 in 780-FBGA package

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