EP3SE80F1152C3 vs EP3SE80F1152I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152C3 sa pamamagitan ng Intel at EP3SE80F1152I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152C3 | EP3SE80F1152I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Device Family | Stratix III E | — |
| Logic Elements | 80,000 | 80,000 |
| Logic Array Blocks (LABs) | 3,200 | — |
| User I/Os | 744 | — |
| Embedded Memory | 6,843,392 bits | — |
| Internal Frequency | 800 MHz | — |
| Maximum DSP Block Frequency | 717 MHz | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Supply Voltage | 1.1 V | — |
| Speed Grade | C3 | I4 |
| Temperature na Operasyon | 0 to 85 C (Commercial) | — |
| Packhaging | FBGA-1152, 35x35 mm | 1152-BBGA, FCBGA (flip-chip) |
| Transceivers | 12 full-duplex channels (family-dependent) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant (per distributor listing) | Compliant |
| Design Software | Quartus II | — |
| Series | — | Stratix III E |
| Embedded Memory Bits | — | 6,843,392 bits |
| User I/O Count | — | 744 |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 450 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| Uri ng Memory | — | SRAM-based configuration |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) |
| I/O Standards Supported | — | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |