EP3SE80F1152I3N vs EP3SE80F1152C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152I3N sa pamamagitan ng Intel at EP3SE80F1152C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
EP3SE80F1152I3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152I3N | EP3SE80F1152C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | Stratix III E | — |
| Logic Elements | 80,000 | — |
| Logic Array Blocks (LABs) | 3,200 | — |
| Embedded Memory Bits | 6,843,392 | — |
| Maximum User I/O | 744 | — |
| Packhaging | 1152-ball FCBGA (Flip-Chip BGA) | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Core Voltage | 1.1 V | — |
| Auxiliary Supply Voltages | 1.2 V, 3.3 V | — |
| Maximum Internal Clock Frequency | 500 MHz | — |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial) | 0C to +85C (commercial, C3 grade) |
| Speed Grade | I3 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Mode | JTAG / Passive Serial / Fast Passive Parallel | — |
| Configuration Encryption | AES-128 bitstream encryption supported | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Series | — | Stratix III E |
| Logic Elements (LEs) | — | 80,000 |
| Total Memory Bits | — | 6,843,392 bits |
| Number of LABs/CLBs | — | 3200 |
| Number of User I/O | — | 744 |
| Bilang ng Outputs | — | 744 |
| Packhaging / Kaso | — | 1152-BBGA, FCBGA (FineLine BGA) |
| Speed/Power Grade | — | C3 |
| Lead Free | — | Yes |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Memory | — | SRAM-based, volatile (needs external config device) |