EP3SE80F1152I4LN vs EP3SE80F1152I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE80F1152I4LN sa pamamagitan ng Intel at EP3SE80F1152I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SE80F1152I4N - 80K LE Stratix III E FPGA, 1152-FCBGA | Intel
EP3SE80F1152I4N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SE80F1152I4LN | EP3SE80F1152I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Huling Pagbili |
| Family | Stratix III E | — |
| Logic Elements | 80,000 | 80,000 |
| Embedded Memory Bits | 6,843,392 bits | 6,843,392 bits |
| Embedded Multipliers (18x18) | 744 | — |
| Maximum Operating Frequency | 500 MHz | — |
| Number of Transceivers | 8 | — |
| User I/O Pins | 488 | — |
| Core Voltage (VCCINT) | 1.1 V | — |
| Volte ng Pagbibigay | 0.9 V | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Package Type | 1152-BBGA, FC-FBGA (FineLine BGA) | — |
| Speed Grade | I4 | I4 |
| Temperature na Operasyon | -40C to +100C (industrial) | — |
| PLLs | 4 | — |
| Global Clocks | 48 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Series | — | Stratix III E |
| User I/O Count | — | 744 |
| Packhaging | — | 1152-BBGA, FCBGA (flip-chip) |
| Core Voltage | — | 1.1 V |
| Maximum Internal Frequency | — | 450 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| Uri ng Memory | — | SRAM-based configuration |
| Configuration Method | — | JTAG / Passive Serial / Fast Passive Parallel (IEEE 1149.1 BST) |
| I/O Standards Supported | — | LVDS, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |