EP3SL200H780I3 vs EP3SL200H780C4L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780I3 sa pamamagitan ng Intel at EP3SL200H780C4L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780I3 | EP3SL200H780C4L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Series | Stratix III L | Stratix III |
| Family | Stratix III | — |
| Logic Elements | 200,000 | 200,000 |
| LABs (Logic Array Blocks) | 8000 | — |
| Total RAM Bits | 10,901,504 (10,900 Kb) | — |
| User I/O Count | 488 | 488 |
| Number of I/O Banks | [DATA_NEEDED: I/O banks] | — |
| Embedded Multipliers (DSP blocks) | 384 (18x18) | — |
| PLLs | 12 | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Core Voltage | 1.1 V | — |
| Maximum Operating Frequency | 717 MHz | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to 85C (commercial) |
| Packhaging | 780-BBGA, FCBGA (HBGA-780) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Supplier Device Package | 780-FBGA (29x29 mm) | — |
| Lead-Free / RoHS | Compliant (lead-free) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Embedded Memory | — | 6.5 Mbit |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Speed Grade | — | -4 (medium performance, commercial) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Tindminan RoHS | — | Compliant |
| Configuration Modes | — | FPP, AS, PS, JTAG |