EP3SL50F484I3 vs EP3SL70F484I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F484I3 sa pamamagitan ng Intel at EP3SL70F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F484I3 EP3SL70F484I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Huling Pagbili
Family Stratix III L (Low Power) Stratix III L
Device Logic Elements 47,500 —
Embedded Memory (bits) 2,184,192 —
Logic Array Blocks (LABs) 1,900 2,700
Maximum User I/O 296 —
Packhaging 484-ball FC-FBGA (Flip-Chip FineLine BGA) 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch
Process Technology 65 nm —
Core Voltage 1.1 V —
Internal Operating Frequency 500 MHz —
Temperature na Operasyon 0 °C to +85 °C (commercial) -40C to +100C (industrial)
Uri ng Pagpapasok Surface Mount —
Lead-Free / RoHS [DATA_NEEDED: lead-free/RoHS status] —
Level ng MSL [DATA_NEEDED: MSL level] —
Configuration Scheme SRAM-based (volatile, requires external config device) —
Transceivers Stratix III L — supports high-speed serial transceivers per family datasheet Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package]
Logic Elements — 67,500
Adaptive Logic Modules (ALMs) — 33,000
Total Embedded Memory — 2,699,264 bits (337 KB)
M9K Memory Blocks — 288
M144K Memory Blocks — 12
DSP Blocks (18x18 multipliers) — 384
User I/O Pins — 296
PLLs — 8 (4 enhanced PLLs + 4 fast PLLs)
Process Node — TSMC 40 nm
Speed Grade — -3 (mid-tier)
Configuration Modes — FPP, AS, PS, JTAG, AES encryption
Design Software — Quartus II (legacy)
Tindminan RoHS — Compliant

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